In focus: The topics of VDMA Materials Handling and Intralogistics
The 3. Interoperability Summit, sponsored by ECLASS, GS1 Germany, Prostep ivip, and VDMA Machine Information Interoperability, will take place on May, 7, 2026 at the Telekom Conference Center in Bonn.
The development of the Digital Product Passport (DPP) is progressing rapidly, but the regulatory requirements and practical implementation are still unclear, especially for small and medium-sized companies. A
Industrial production is under increasing competitive pressure.
From May 28 to 31, 2025, the manufacturing world will gather in Istanbul for WIN EURASIA, one of the leading industrial trade fairs in the Eurasian region.
The production of modern batteries requires complex production lines and therefore presents companies with considerable challenges in production.
In this interview, Rene Hirschmugl reveals the importance of interoperability in the industry and why he sees OPC UA Companion Specifications as a great opportunity.
New release candidate OPC 40505 published. The Joint Working Group "OPC UA for Wireless Machine Tool Peripherals" has developed the OPC UA Companion Specification 40505 and submitted it to the OPC Foundation as a release candidate.
A consortium of organizations has published a groundbreaking specification for interoperable and efficient energy management in industrial automation and process automation.
VDMA and T-Systems, together with the umati initiative, are presenting the first global Manufacturing-X solution with open standards for machine data at this year's Hannover Messe.
The United States is expanding its manufacturing capabilities by investing in a network of institutes, each specializing in a specific area, for example technology or workforce development.
Data Spaces enable secure data exchange and unlock untapped potential. Hannover Messe 2025 offers the ideal platform to present the current state of the industry.
At Hannover Messe (31 March to 4 April 2025), the umati initiative will once again be represented with its own stand in Hall 9, Stand F25.
Traditionally, simulations of transmission systems are based on idealized models that are based on nominal values.
The OPC UA standard has become an integral part of modern sheet metal production. The universal interface technology enables your machines to communicate securely and in a standardized way with connected IT systems.
With the Call for Papers, HANNOVER MESSE is addressing all exhibitors and partners who would like to enrich the content of the forum program at the world's most important industrial trade fair with their contributions.
The cooperation of numerous manufacturers of shot blasting machines has resulted in a new OPC UA standard, which is about to be published. A further step towards interoperable production.
The cooperation of numerous manufacturers of plasma surface treatment machines has resulted in a new OPC UA standard, which is about to be published. A further step towards interoperable production.
The PA-DIM Working Group has released Version 1.1 of the standard, expanding to include support for analyzer device types and data modeling extensions. This enhancement improves interoperability for process applications in automation.
AI is revolutionizing mechanical engineering. Its use in control systems for monitoring and optimization needs specific data formats. OPC UA ensures seamless data exchange, easing AI integration and expanding its role in automation.
The umati initiative shows a demonstrator for federated data spaces together with Siemens, WZL Aachen, Telekom and VDMA. This integrates existing applications and emphasises standardised data in order to establish global data ecosystems.
SMARTENANCE aims to harmonize data spaces across different sectors, modernize IoT platforms, demonstrate the performance of multilateral digital value chains and support data space participation.
On this page you will find all publications about OPC UA and interoperability for download.
Your contacts in the trade associations and regional subsidiaries on this topic