Networking between mechanical engineering, research, semiconductor manufacturers and politics - with NXP and the FMD
Event finished
Free event
The VDMA Productronics department is pleased to invite you to the High-Level Round Table at Fraunhofer IZM in Berlin on March 24/25, 2025.
Event finished
Free event
- Fraunhofer-Institut für Zuverlässigkeit
- und Mikrointegration IZM
- Gustav-Meyer-Allee 25
- 13355 Berlin
Event language
- German
The VDMA Productronics department is pleased to invite you to the High-Level Round Table at Fraunhofer IZM in Berlin on March 24/25, 2025.
The aim of the event is to build networks and promote dialog between semiconductor manufacturers, mechanical and plant engineering, politics and research.
The Fraunhofer IZM production tour will give you an insight into the latest embedding and substrate technologies for semiconductor production.
Find out about the opportunities for plant engineering through the new APECS pilot line, prospects for Germany as a microelectronics location on the part of politicians, the semiconductor manufacturer NXP Semiconductors and the mechanical and plant engineering industry.
Networking Dinner
On the evening of 24.03.25 at 18:30 we cordially invite you to a networking dinner at the Restaurant
Einstein, Unter den Linden 42, 10117 Berlin.
The number of participants is limited to 24.
For further information on the program, please see the attached flyer.
The Fraunhofer IZM production tour will give you an insight into the latest embedding and substrate technologies for semiconductor production.
Find out about the opportunities for plant engineering through the new APECS pilot line, prospects for Germany as a microelectronics location on the part of politicians, the semiconductor manufacturer NXP Semiconductors and the mechanical and plant engineering industry.
Networking Dinner
On the evening of 24.03.25 at 18:30 we cordially invite you to a networking dinner at the Restaurant
Einstein, Unter den Linden 42, 10117 Berlin.
The number of participants is limited to 24.
For further information on the program, please see the attached flyer.
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